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Repair & Rework of Electronic Assemblies
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Instead of scrapping out an expensively-built assembly, send it our way. Our split-vision SniPER™ extracts ball grid arrays (BGAs), fine-pitch quad flat packs, and other chip-scale packages and replaces them with new components. With precision-alignment features the SniPER™ replaces components in true position automatically. BGAs are subjected to X-ray inspection to verify proper placement.
If you have production assemblies that need part swap-outs, send it our way. We have performed higher volume repairs that require disassembly, removal of coatings, de-soldering, hand-placing with the correct component value(s), soldering, re-coating, and testing.
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