Surface Mount & Through-hole Assemblies

ROLL OVER GALLERY TO VIEW MORE PHOTOS

Our two contiguous manufacturing lines consists of two stencil printers, two recently upgraded MYDATA® MY-9 surface mount machines with Hydra speedmount heads, 5-zone and 7-zone reflow ovens, a through-hole slide line, and a tin-lead wave solder process. This area is supplemented with multiple work cells to provide hand assembly, box builds, workmanship inspections and testing.

We are placing chip-scale components (down to 0402 and 15-mil pitch packages) as well as ball-grid arrays (BGAs with X-ray inspection). We also work with hand-placing odd-form components that require precision handling and soldering.

RoHS Initiative
Even though many of our customers from the various industry segments are exempt from the requirements of becoming RoHS-compliant, Alliance Group Technologies is offering small-quantity lead-free builds.